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By John H. Lau,Cheng Kuo Lee,C. S. Premachandran,Yu Aibin

A complete advisor to 3D MEMS packaging tools and solutions

Written by way of specialists within the box, Advanced MEMS Packaging serves as a worthy reference for these confronted with the demanding situations created through the ever-increasing curiosity in MEMS units and packaging. This authoritative consultant provides state of the art MEMS (microelectromechanical structures) packaging thoughts, comparable to low-temperature C2W and W2W bonding and 3D packaging.

This definitive source is helping you choose trustworthy, inventive, high-performance, strong, and low in cost packaging thoughts for MEMS units. The e-book also will relief in stimulating additional examine and improvement in electric, optical, mechanical, and thermal designs in addition to fabrics, procedures, production, checking out, and reliability. one of the subject matters explored:

  • Advanced IC and MEMS packaging trends
  • MEMS units, advertisement functions, and markets
  • More than 360 MEMS packaging patents and 10 3D MEMS packaging designs
  • TSV for 3D MEMS packaging
  • MEMS wafer thinning, dicing, and handling
  • Low-temperature C2C, C2W, and W2W bonding
  • Reliability of RoHS-compliant MEMS packaging
  • Micromachining and water bonding techniques
  • Actuation mechanisms and built-in micromachining
  • Bubble change, optical swap, and VOA MEMS packaging
  • Bolometer and accelerameter MEMS packaging
  • Bio-MEMS and biosensor MEMS packaging
  • RF MEMS switches, tunable circuits, and packaging

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Advanced MEMS Packaging by John H. Lau,Cheng Kuo Lee,C. S. Premachandran,Yu Aibin

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